Virtual PCB


Attendee Information


2010 Technical Conference/Auditorium Content

Held in the Auditorium:

  • Next Generation Design Data Management

  • Solving Mechanical Challenges with a 3D PCB Environment - Make Sure it Fits the First Time!

  • Optimizing Power Delivery with Effective Decoupling

  • Using FPGAs to Embed Test Instruments into Your PCB Design

  • How Interconnects Can Screw Up High Speed Serial Link Signals and What Transceivers Can Do About It

  • DDR3 Design and Analysis

  • How to Plan your Design to Save Layers and Time

  • Product Development System for Electronic and High Tech Companies


Available On Demand in SMTA booth*:


* a small fee may apply to view the SMTA webcasts.


Resource Center Highlights

  • New and Emerging Technologies in Electronics

  • Flip Chip: What, Why and How


Group Chats (archived)

Previous Chat Dialog Available in the Scheduled Chat Room


Altium

  • Solving Mechanical Challenges in a 3D PCB Environment - Make Sure it Fits First Time!
  • Next Generation Design Data Management
  • Next Generation System Design - Platforms versus Tool-Chains
  • Using FPGAs to Embed Test Instruments into your PCB Design

EMA

  • Migrating Designs to Cadence OrCAD PCB Editor
  • Maximizing Your Library Management
  • Defining and Passing Height Properties
  • Cadence PSpice A/D for Maximized Circuit Performance

Engelmaier Associates


H&L Instruments

  • The Hard Truths of Tin Whiskers

Imagineering

  • Rigid/Flex
  • LEDs and PCBs
  • Metal/Plastic Enclosures and Key Pads

National Instruments

  • Easy (and Cost-Effective Ways) to Prototype Faster

New Venture Research Corp.


Zuken

  • Understanding the Requirements for High Speed Design Routing
  • Signal Integrity Primer
  • Full integration between MCAD and ECAD
  • Signal Integrity Verification