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Attendee Information
Held in the Auditorium:
- Next Generation Design Data Management
This webinar will cover version control, design documentation, library management, manufacturing outputs and more, made simple.
- Solving Mechanical Challenges with a 3D PCB Environment - Make Sure it Fits the First Time!
See for yourself just how easy it is to unify ECAD and MCAD design processes around common design files and use the power of 3D to get designs right first time.
- Optimizing Power Delivery with Effective Decoupling
This session will discuss the ever-growing need for appropriate decoupling to meet the AC current demands of today's power-hungry ICs. Issues such as the number of decoupling capacitors, which values to use, and how to mount the capacitors will be discussed, as well as optimizing your design to reduce cost and use fewer layers. We will also illustrate how analysis of the problem can lead to a more robust power system, allowing you to get to market faster and have confidence in your PCB design.
- Using FPGAs to Embed Test Instruments into Your PCB Design
See how the programmability of FPGAs can change the way you design and test your products.
- How Interconnects Can Screw Up High Speed Serial Link Signals and What Transceivers Can Do About It
There are four families of problems all high speed signals suffer from the interconnects. In this presentation, the four problems are introduced and then how the chip can partially compensate.
- DDR3 Design and Analysis
This paper describes a flow for modeling and simulation of a complete DDR3 interface including the controller package, PCB and memory DIMMs. Primary focus is on the comprehensive modeling of the controller package including ISI, crosstalk and SSO in SigXplorer and PCB-SI. It also presents the PCB-SI timing capabilities and how that combined with the rigorous package models provides a complete solution for DDR3 designs.
- How to Plan your Design to Save Layers and Time
With today's ever increasing routing challenges, we need tools and methodologies to help make complex designs more manufacturable and give us quicker time to market. The tools and technology we used in the past are unsuitable for today's most complex designs. Automation is great, but the best results usually occur when you combine a good designer's talents with the proper tools. This presentation will discuss how you can plan your design using Cadence’s Interconnect Flow Planner to save time and money.
- Product Development System for Electronic and High Tech Companies
The pressure to find a competitive edge in today's electronics high tech industry is intensifying. Product Development itself is getting harder and efficiently managing information across your supply chain is becoming ever more critical. In addition to optimizing suppliers, components and pricing, it is critical to track and report every aspect of the electronics product design process. Discover how PTC, integrated with the Cadence solution can help you build highly efficient teams to fuel product innovation.
Available On Demand in SMTA booth*:
* a small fee may apply to view the SMTA webcasts.
Resource Center Highlights
- New and Emerging Technologies in Electronics
There are four families of problems all high speed signals suffer from the interconnects. In this presentation, the four problems are introduced and then how the chip can partially compensate.
Speaker: Daniel F. Baldwin, Ph.D., Engent Inc.
- Flip Chip: What, Why and How
Flip chip assembly technology is gaining increased acceptance in the electronics industry. Annual growth rates projected through the next decade are 40% or higher. While flip chip technology was developed over thirty years ago by IBM and has been in production on ceramic substrates, it has yet to achieve cost competitiveness with high-volume semiconductor packaging and low-cost surface mount technology. To achieve cost competitiveness, new and innovative material systems and process technologies are required. This presentation will review the fundamentals of flip chip technology, starting with the basic materials and construction, followed by a review of typical technology and market drivers leading to flip chip selection, and finally a review of the basic process technologies for flip chip assembly.
Speaker: Daniel F. Baldwin, Ph.D., Engent Inc.
Previous Chat Dialog Available in the Scheduled Chat Room
Altium
- Solving Mechanical Challenges in a 3D PCB Environment - Make Sure it Fits First Time!
Have you ever had an expensive PCB design come back from manufacturing only to find it won't fit into its box? Or ever wondered if there was a better way to accommodate complex mechanical constraints when laying out your PCB designs? Don't waste your time with paper cut-outs and inaccurate mechanical mock-ups. Here's your opportunity to find out more about mechanical and electronic co-design in real-time 3D, or just have a chat on the topic with Dr Marty Hauff. He also presented a widely popular webinar about this - watch it on demand in the auditorium.
Speaker: Dr. Marty Hauff
- Next Generation Design Data Management
Have you ever struggled to keep track of your design files? Managing legacy files? Does your design team spend more time manually rekeying bills of materials into your ERP or MRP systems than they do innovating? Have they ever gone to production with components that turned out to be end-of-life'd, obsolete, or just not available in the quantities or at the price you needed, when you needed them? Are you feeling increasing pressure to connect your design team into the wider organization and streamline things like part-parameter management, release processes, design revisions, design variants, etc? Join us for a chat on creating a pushbutton design data management system and/or follow-up with Matthew on our most recent webinar topic (now on demand in the auditorium to re-visit).
Speaker: Matthew Berggren
- Next Generation System Design - Platforms versus Tool-Chains
Companies doing electronics design continue to design products by cobbling together a collection of tools to create what is commonly referred to as the "tool-chain". So how effective is this really, especially when you are building complicated products that require multi-domain expertise spread among dispersed design teams? This session dedicates discussion around unified design platform as a new architecture to support multiple domains (PCB, FPGA and embedded software) and how it can offer significant productivity improvements over managing the "tool-chain". Bring your questions to the table! The speaker also just released a white paper on this topic - you can download this immediately from the Altium booth.
Speaker: Bob Potock
- Using FPGAs to Embed Test Instruments into your PCB Design
So just how easy is it to exploit the flexibility of FPGAs for more functionality and greater hardware opportunities? You don't need any specialist VHDL/Verilog skills to start reaping the benefits of FPGAs today. Embedded instrumentation adds virtually no cost to your design, but gives you more control than expensive test equipment. You can use embedded test instrumentation to rapidly create custom user interfaces and diagnostic panels. Embedded test instruments can go wherever your program does, so everything you need to diagnose a fault is at your fingertips. You can even get a window into your hardware internals with control and data visibility like never before! Dr. Marty Hauff presented this highly successful webinar (on demand in the auditorium) and will also be available to chat further on the topic.
Speaker: Dr. Marty Hauff
EMA
- Migrating Designs to Cadence OrCAD PCB Editor
When migrating to a new CAD tool one of the primary concerns is to save important data in existing designs and libraries. This chat session will discuss how to migrate data from other CAD tools into Cadence® OrCAD® PCB Editor. Discover how to migrate library data and the steps needed to make it fully enhanced and compatible.
- Maximizing Your Library Management
Are you properly sharing libraries within your company? This chat session will discuss the fundamentals of library management. Discover how to create, configure, use and manage schematic library data using Cadence® OrCAD® Capture CIS.
- Defining and Passing Height Properties
Many engineering departments can benefit from added integration of schematic capture, PCB layout, and their mechanical departments. This chat session will discuss how to add and define height properties efficiently in Cadence® OrCAD® Capture CIS and easily pass property information from schematic, to PCB, and then through to the mechanical CAD system in the form of IDF data.
- Cadence PSpice A/D for Maximized Circuit Performance
Simulating a circuit prior to building it is crucial, but simulation is only part of the solution. In this chat session we will discuss where to get models, how to create your own, and how to get power IC models that are difficult to create. Discover how to optimize your design, improve its reliability, minimize part cost, and maximize yield.
Engelmaier Associates
H&L Instruments
- The Hard Truths of Tin Whiskers
Industry for the most part accepted the conversion to lead-free solders, but with that has come many high-profile instances of tin whiskers. Indeed, use of RoHS electronics in high-reliability systems within automobiles can make for a deadly cocktail. While Toyota, for example, is still researching the causative agent behind its recent sudden acceleration problems, reports tell tales of new autos that will not start as a result of tin whiskers. Bob Landman, a reliability expert and a Life Senior Member of IEEE, moderates this discussion of tin whisker causes and mitigation.
Speaker: Bob Landman, Chief Technical Officer
Imagineering
- Rigid/Flex
Information pertaining to how Imagineering fabricates PCBs.
- LEDs and PCBs
An enlightening discussion on thermal properties of metal substrates and how they impact your designs.
- Metal/Plastic Enclosures and Key Pads
How one source for metal stamping and injection molding can streamline your procurement process.
National Instruments
- Easy (and Cost-Effective Ways) to Prototype Faster
This moderated chat will speak to the benefits of integrating simulation into the design flow for the purposes of component evaluation, design verification, and prototype validation. This often-overlooked technology has become one of the most cost-effective ways to overcome unnecessary prototype iterations, and we will look at tips, tricks and general best practices used by engineers. Throughout this session we will discuss how National Instruments approaches analysis, and will open the floor to engineers to gain perspective on their current and future use of this this technology.
Moderator: Bhavesh Mistry
New Venture Research Corp.
Zuken
- Understanding the Requirements for High Speed Design Routing
This session will focus on the common requirements for routing designs to achieve optimal high-speed results. Join us for a discussion on how to achieve fundamental results using topologies, impedance calculations, differential pairs/base signals in data bus skew groups. If these terms are still new to you and are challenged by designs using current CPUs and DDR3/3 memory, this discussion is for you.
Speaker: Andy Buja, Zuken
- Signal Integrity Primer
Achieving good signal integrity on PCBs is everyone's concern. Even if you're not an electrical engineer, you, too, can understand the mechanisms and the mitigation strategies for realizing high-speed boards. If you have questions about how characteristic impedance is different from trace resistance, why some signals use termination or a particular topology, or simply want to understand what's behind the electrical constraints that the engineer specifies, then this session is for you. No previous electrical understanding is necessary.
Speaker: Griff Derryberry, Zuken
- Full integration between MCAD and ECAD
This session will discuss the benefits of using a 3D Design Tool to integrate mechanical and electrical designs. Talk with an expert to understand why it's important to be able to import and view housing and package designs, insert your board and placed components and automatically check for clearance violations in all dimensions.
Speaker: Doug Boone, PCE Texas
- Signal Integrity Verification
Join this discussion on the importance of signal integrity analysis. Discuss methods for quickly determining design constraints, finding and limiting crosstalk and determining constraints on nets for eventual manual or automatic routing - all essential components in a successful design.
Speaker: Doug Boone, PCE Texas
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